Heat flows in, temperatures spread, parts expand — how hot, where, and what stress does the expansion cause?
1. What is it?
Steady thermal: heat sources and sinks balance out; you get the final temperature map. "Will this heatsink keep the chip under 85 °C?"
Transient thermal: temperature vs time after a switch-on or a step change. "How long until the centre of this block reaches 60 °C?"
Thermo-mechanical: the temperature field makes the part expand; constrained expansion = stress. "Will this bimetal joint warp or crack?"
2. When do I use it?
You have…
Use
Example
Steady heat source + sink
Steady thermal
Heatsink design
Switch-on, step change, time-varying
Transient thermal
Warm-up time
Temperature causes stress
Thermo-mechanical
Exhaust manifold
Convection/radiation losses
Surface BCs
Cooling fin
Use cases
Problem Type
Industry
Example
Heat exchanger design
Energy/Chemical
Tube sheet temperature distribution
Electronic cooling
Electronics
PCB thermal management
Thermal stress in piping
Power plants
Hot pipe expansion analysis
Casting solidification
Manufacturing
Mold temperature history
Cryogenic insulation
Aerospace
LNG tank thermal performance
Thermal barrier coating
Energy/Turbine
Temperature gradient across TBC
3. The flow
On macOS, author the solid in Design Studio (step 1), apply the hot/cold face pair on Conditions (suggested thermal setup), then Review → Mesh (keep the Hex8 solid) → Solve Thermal Steady-State or Thermo-Mechanical. See [Design Studio 7-stage pipeline](design-studio-pipeline.md).